What puts the Helios NanoLab in a class of its own is its ability to offer the highest imaging, contrast, stability and speed performance together with the largest range of SEM / FIB applications. It ensures best resolution, reproducible metrology and best control of the beam for writing purposes.  The outstanding imaging capabilities of the Helios NanoLab start with its novel FESEM technology, featuring resolution in the sub-nanometer at 15kV and better than 1.5nm at 1kV without beam deceleration. Stunning image quality and contrast are achieved, especially when using the new Helios NanoLab through-the-lens detector. Its innovative design allows for superb imaging in SE and BSE modes over the entire energy range. When imaging is used for metrology purposes, Helios NanoLab introduces a significant breakthrough with its electron beam electrostatic scanning, which allows for pioneering accuracy performance.

A new level for NanoWork
While pushing the limits of 2D and 3D nanocharacterization, through integrated Slice and View™ tomography or FEI’s automated 3D EBSD collection package called EBS3™, Helios NanoLab also delivers the most advanced integrated solutions for nanoprototyping. Its 16-bit digital patterning engine teams up with FEI-developed FIB milling protocols, which are readily available from the user-friendly software interface. A wide range of patterning strategies are available to optimize electron and ion beam writing and processes; including FEI’s proprietary gas injection processes to deposit the largest number of different materials in 3D. For electron beam lithography, Helios NanoLab rewrites the rules with its novel high-speed and linear electro-static scanning coupled to a new, fast, integrated beam blanker. Helios NanoLab excels in preparing the highest quality samples. Using FEI’s AutoTEM™ G² software, thin samples can be prepared rapidly and automatically, with high reliability and extreme ease of use.